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IEC 60068-2-58 Ed. 3.0 b:2005

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

standard by International Electrotechnical Commission , 02/23/2005

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Full Description

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
 

Product Details

Edition:
3.0
Published:
02/23/2005
Number of Pages:
53
File Size:
1 file , 1.3 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60068-2-58 Ed. 4.1 en:2017


    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) CONSOLIDATED EDITION

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  2. IEC 60068-2-58 Ed. 4.0 b:2015


    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version

  3. IEC 60068-2-58 Ed. 3.0 b:2005

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    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version

  4. IEC 60068-2-58 Ed. 3.0 b:2004


    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

    • Historical Version