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About This Item

 

Full Description

Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
 

Document History

  1. IEC 60068-2-20 Ed. 6.0 b:2021


    Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

    • Most Recent
  2. IEC 60068-2-20 Ed. 5.0 b:2008


    Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

    • Historical Version
  3. IEC 60068-2-20 Ed. 5.0 en:2008


    Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

    • Historical Version
  4. IEC 60068-2-20 Ed. 4.0 b:1979

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    Environmental testing. Part 2: Tests. Test T: Soldering

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IEC 60068-2-20 Amd.2 Ed. 4.0 b:1987


    Amendment 2 - Environmental testing. Part 2: Tests. Test T: Soldering