The buildings industry now has a powerful new integrated circuit (IC) chip with built-in support for both BACnet®/IP and LonWorks® ANSI/EIA-709.1 networks. Many manufacturers and product designers have now focused their efforts higher up the system architecture. The fact that there is now an Ethernetbased “dual protocol” chip on the market makes it even more apparent that the goal for next-generation embedded products is to integrate the facility and concentrate on the important issue of bringing value to enterprise applications.