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Document History

  1. DIN EN 61189-3-719

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    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016

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  2. DIN EN 61189-3-719 - DRAFT


    Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling (IEC 91/1152/CD:2013)

    • Historical Version