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About This Item

 

Full Description

BS EN IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.


Cross References:
IEC 61191-4
IPC-A-610
EN 61191-4
IEC 61191-2
EN 61190-1-1
IEC 61249-8-8
IEC 61340-5-1
EN 60068-2-58
IEC/TR 61340-5-2
IEC 60068-2-20
IEC 61189-1
CLC/TR 61340-5-2
IEC 61190-1-3
EN 61191-2
EN 61249-8-8
IEC 60721-3-1
IEC 61191-3
EN 61189-1
IEC 60068-2-58
EN 61191-3
IEC 61189-3
EN 60068-2-20
IEC 60194
EN IEC 60721-3-1
EN 61340-5-1
EN 61760-2
IEC 61760-2
EN IEC 61190-1-3
EN 61189-3
ISO 9001:2008
IEC 61190-1-1
J-STD-033
IEC 61188-5-6
EN 61188-5-5
EN 62326-1
IPC-SM-817
IEC 61188-5-2
EN 61189-2
IPC-9191
J-STD-003
IEC/PAS 62326-7-1
IEC 61189-2
IEC 61193-3
EN 61190-1-2
EN 62326-4
EN 61188-5-1
EN 61188-5-4
J-STD-005
EN 61193-1
J-STD-002
IPC-OI-645
IEC 61188-5-3
IEC 61189-5-502
IEC 61188-5-4
EN 61188-7
J-STD-006
IEC 61188-5-5
EN 61193-3
J-STD-004
IEC 62326-1
IEC 61188-7
IEC 61188-5-1
IEC 62326-4
EN 61188-5-2
J-STD-001
IEC 61190-1-2
EN 61188-5-3
J-STD-020
IPC-9202
EN 61188-5-6
IPC-TM-650
IEC 61193-1


All current amendments available at time of purchase are included with the purchase of this document.
 

Document History

  1. BS EN IEC 61191-1:2018

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    Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    • Most Recent
  2. BS EN 61191-1:2013


    Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    • Historical Version
  3. BS EN 61191-1:1999


    Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    • Historical Version