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About This Item

 

Full Description

BS EN 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.


Cross References:
IEC 60191-2
IEC 60191-6
EN 60191-6


All current amendments available at time of purchase are included with the purchase of this document.
 

Document History

  1. BS EN 60191-6-13:2016

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    Mechanical standardization of semiconductor devices-Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

    • Most Recent
  2. BS EN 60191-6-13:2007


    Mechanical standardization of semiconductor devices-Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA)

    • Historical Version