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About This Item

 

Full Description

This European Standard specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information technology (IT) and, more generally, telecommunications equipment is intended to be installed in order to:

a) minimize the risk to the correct function of that equipment and interconnecting cabling from electrical hazards;

b) provide the telecommunications installation with a reliable signal reference - which may improve immunity from electromagnetic interference (EMI).

Cross References:
EN 50174-2:2009
IEC 62305-4
IEC 60364-5-54
EN 61140
IEC 60364-4-41
IEC 61557-5
IEC 61140
EN 50083
EN 60728
HD 60364-5-54
IEC 60728
IEC 60364-4-44
EN 61557-4
HD 60364-4-444
A1:2011
EN 61557-5
HD 60364-4-41
IEC 61557-4
EN 62305-4
ETSI EN 300 253:2015
EN 60297-3-105
EN 50174-3
IEC 60950-1
EN 50346
IEC 60079-14
EN 60079-14
EN 62305-3
EN 50700
EN 62305
IEC 60297-3-105
ETSI EG 201 147:1998
EN 60950-1
IEC 62305-3
IEC 60050-195
CLC/TR 50174-99-1
EN 50174-1
IEC 60050-826:2004
EN 50173


Incorporates the following:
Amendment, March 2020
 

Document History

  1. BS EN 50310:2016+A1:2020

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    Telecommunications bonding networks for buildings and other structures

    • Most Recent
  2. BS EN 50310:2016


    Telecommunications bonding networks for buildings and other structures

    • Historical Version
  3. BS EN 50310:2010


    Application of equipotential bonding and earthing in buildings with information technology equipment

    • Historical Version
  4. BS 09/30205182 DC


    BS EN 50310. Application of equipotential bonding and earthing in buildings with information technology equipment

    • Historical Version
  5. BS EN 50310:2006


    Application of equipotential bonding and earthing in buildings with information technology equipment

    • Historical Version
  6. BS EN 50310:2000


    Application of equipotential bonding and earthing in buildings with information technology equipment

    • Historical Version