1.1 This test method covers a procedure for testing components for oxygen contribution to ultra-high purity gas distribution systems at ambient temperature. In addition, this test method allows testing of the component at elevated ambient temperatures as high as 70°C.

1.2 This test method applies to in-line components containing electronics grade materials such as those used in a semiconductor gas distribution system.

1.3 Limitations:

1.3.1 This test method is limited by the sensitivity of current instrumentation, as well as the response time of the instrumentation. This test method is not intended to be used for test components larger than 12.7-mm ( 1/2-in.) outside diameter nominal size. This test method could be applied to larger components; however, the stated volumetric flow rate may not provide adequate mixing to ensure a representative sample. Higher flow rates may improve the mixing but excessively dilute the sample.

1.3.2 This test method is written with the assumption that the operator understands the use of the apparatus at a level equivalent to six months of experience.

1.4 The values stated in SI units are to be regarded as the standard. The inch-pound units given in parentheses are for information only.

1.5 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. Specific hazard statements are given in Section 6.