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Full Description

1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.

1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.

1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.

1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.

1.5 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

 

Document History

  1. ASTM B490-09(2014)


    Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

    • Most Recent
  2. ASTM B490-09


    Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

    • Historical Version
  3. ASTM B490-92(2008)e1


    Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

    • Historical Version
  4. ASTM B490-92(2003)


    Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

    • Historical Version
  5. ASTM B490-92(1998)

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    Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

    • Historical Version