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IPC 6018D

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

standard by Association Connecting Electronics Industries , 02/01/2022

📝 Amendments Available

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About This Item

 

Full Description

This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. 

The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.

 

Product Details

Published:
02/01/2022
ISBN(s):
9781638160601
Number of Pages:
60
File Size:
1 file , 2.7 MB
Product Code(s):
6018-STD-0-D-0-EN-D
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC 6018D

    👀 currently
    viewing


    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    • Most Recent

  2. IPC 6018C


    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    • Historical Version

  3. IPC 6018B


    Microwave End Product Board Inspection and Test

    • Historical Version

  4. IPC 6018A


    Microwave End Product Board Inspection and Test

    • Historical Version

  5. IPC 6016


    Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IPC 6018DS


    Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards