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About This Item

 

Full Description

Establishes requirements for qualification and performance of high frequency (microwave) printed wiring boards. Covers both end product inspection and test of microwave boards for microstrip, stripline, mixed dielectric and multilayer stripline applications. Enhancements over previous revision include updated tables for surface finish requirements and annular ring, as well as revised requirements for microsectioned test specimen and production boards.
 

Document History

  1. IPC 6018D


    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    • Most Recent
  2. IPC 6018C


    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    • Historical Version
  3. IPC 6018B


    Microwave End Product Board Inspection and Test

    • Historical Version
  4. IPC 6018A

    👀 currently
    viewing


    Microwave End Product Board Inspection and Test

    • Historical Version
  5. IPC 6016


    Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

    • Historical Version