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BS EN 61190-1-2:2007

Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

standard by British-Adopted European Standard , 07/31/2007

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Cross References:
IEC 60194
IEC 61189-5
IEC 61189-6
IEC 61190-1-1
IEC 61190-1-3
IEC 61191-1
IEC 61191-2
IEC 61191-3
IEC 61191-4
ISO 9000
ISO 9001
ISO 9453
ISO 9454-2
ISO 10012-1
EN 60194:2006
EN 61189-5:2006
EN 61189-6:2006
EN 61190-1-1 2002
EN 61190-1-3:2007
EN 61191-1:1998
EN 61191-2:1998
EN 61191-3:1998
EN 61191-4:1998
EN ISO 9000:2005
EN ISO 9001:2000
EN ISO 9453:2006
EN ISO 9454-2:2000
EN 30012-1:1993
 

Product Details

Published:
07/31/2007
ISBN(s):
9780580553363
Number of Pages:
22
File Size:
1 file , 1.3 MB
Product Code(s):
30133285, 30133285, 30133285
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN 61190-1-2:2014


    Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Most Recent

  2. BS EN 61190-1-2:2007

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    Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly

    • Historical Version

  3. BS 05/30133283 DC


    IEC 61190-1-2 ED 2. Attachment materials for electronic assembly. Part 1-2. Requirements for soldering paste for high-quality interconnects in electronics assembly

    • Historical Version

  4. BS EN 61190-1-2:2002


    Attachment materials for electronic assembly-Requirements for solder pastes for high-quality interconnections in electronic assembly

    • Historical Version