IEEE/IEC 63055-2023
IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design
standard by IEEE/IEC , 10/19/2023
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About This Item
Full Description
Scope
This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.
Purpose
The general purpose of this standard is to develop a common format that LPB design tools can use to exchange information/data seamlessly, as opposed to having to work with multiple different input and output formats.
Abstract
Adoption Standard - Active.
A method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in the large-scale integration-package-board designs. The method provides the ability to make electronic systems a key consideration early in the design process; design tools can use it to seamlessly exchange information/data.
