This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that AHP electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.

It is intended to communicate requirements for a Lead-free Control Plan (LFCP), hereinafter referred to as the Plan, and to assist suppliers in the development of their own Plans. The Plan documents the Plan owner's (supplier's) processes, that assure their customers, and all other stakeholders that the Plan owner's products will continue to meet their requirements.

This standard does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the AHP industries that must be addressed by the processes.

This standard applies only to entities within the control of the AHP electronics system supply chain; and is intended to address issues that are unique to those industries. Some applications may have unique requirements that exceed the scope of this standard, and should be covered separately.