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Full Description

This Technical Information Paper is presented to serve as a guide in understanding the characteristics of hot melt adhesives used in packaging applications, the terms that are used to express these characteristics, and the factors that influence the adhesives performance. This TIP also serves as a guide in understanding the components of hot melt application systems and their function in the dispensing cycle.
 

Document History

  1. TAPPI TIP 0304-74


    Understanding and Troubleshooting Hot Melt Adhesives

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  2. TAPPI TIP 0304-74

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    Understanding and Troubleshooting Hot Melt Adhesives

    • Historical Version