This paper describes the integration of an automated, patterned wafer, defect inspection system into the overall defect density engineering strategy for a wafer manufacturing area. These systems are now capable of efficiently collecting statistically representative data directly from product material. The core of this strategy is the routine sampling and in-line defect inspection of production material. This enables rapid, early detection of defects in the manufacturing line and the development of a systematic response to the problems that are observed. In addition, this sampling plan drives continuous improvement of defectivity within the wafer manufacturing area.