JEDEC JESD22-B113

BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS

standard by JEDEC Solid State Technology Association , 03/01/2006

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Full Description

The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.

Product Details

Published:: 03/01/2006
Number of Pages:: 21
File Size:: 1 file , 250 KB
Note:: This product is unavailable in Russia, Ukraine, Belarus