Language:
    • Available Formats
    • Options
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $67.00
    • Add to Cart
    • Printed Edition + PDF
    • Immediate download
    • $90.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

This Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test.
 

Document History

  1. JEDEC JESD22-B111A

    👀currently
    viewing


    BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS

    • Most Recent
  2. JEDEC JESD22-B111


    BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS

    • Historical Version