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JEDEC JESD22-B109B

FLIP CHIP TENSILE PULL

standard by JEDEC Solid State Technology Association , 07/01/2014

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Full Description

The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test.
 

Product Details

Published:
07/01/2014
Number of Pages:
16
File Size:
1 file , 72 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC JESD22-B109B

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    FLIP CHIP TENSILE PULL

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  2. JEDEC JESD22-B109A


    FLIP CHIP TENSILE PULL

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