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About This Item

 

Full Description

This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).
 

Document History

  1. JEDEC JESD22-A113I

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    Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

    • Most Recent
  2. JEDEC JESD22-A113H


    PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

    • Historical Version
  3. JEDEC JESD22-A113G


    PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

    • Historical Version
  4. JEDEC JESD22-A113F


    PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

    • Historical Version