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Full Description

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
 

Document History

  1. JEDEC JEP167A

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    Characterization of Interfacial Adhesion in Semiconductor Packages

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  2. JEDEC JEP167


    Characterization of Interfacial Adhesion in Semiconductor Packages

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