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NOTE - The Moisture Sensitive Caution Label (figure 3-4) has been editorially revised since originally posted 11/04/05, if you downloaded this file prior to 12/14/05 please download this revised version. This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. Now updated to support components that may need to be processed at higher temperatures, such as lead-free processes, these methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. IPC/JEDEC J-STD-033B helps achieve safe and damage-free reflow with the dry packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags.
 

Document History

  1. JEDEC J-STD-033D


    Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

    • Most Recent
  2. JEDEC J-STD-033C


    JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

    • Historical Version
  3. JEDEC J-STD-033B.1

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    JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

    • Historical Version