Language:
    • Available Formats
    • Options
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $75.00
    • Add to Cart
    • Printed Edition + PDF
    • Immediate download
    • $101.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. It is used to determine what classification level should be used for initial reliability qualification. Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. This revision now covers components to be processed at higher temperatures for lead-free assembly.
 

Document History

  1. JEDEC J-STD-020F


    JOINT IPC/JEDEC STANDARD FOR Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)

    • Most Recent
  2. JEDEC J-STD-020E

    👀 currently
    viewing


    JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES

    • Historical Version
  3. JEDEC J-STD-020D.01


    JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES

    • Historical Version