1588967

IPC T-50H

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

standard by Association Connecting Electronics Industries , 07/01/2008

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About This Item

 

Full Description

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision H contains over 200 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, conductor patterns, assembly processes, base materials and selective plating processes. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.
 

Product Details

Edition:
9th
Published:
07/01/2008
Number of Pages:
152
File Size:
1 file , 5.1 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC T-50N


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Most Recent

  2. IPC T-50M


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

  3. IPC T-50K


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

  4. IPC T-50J


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

  5. IPC T-50H

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    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version

  6. IPC T-50G


    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    • Historical Version