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About This Item

 

Full Description

This standard provides a marking and labeling system that aids in assembly, rework, repair and recycling and provides for the identification of:
  1. those assemblies that are assembled with lead-containing or lead-free solder;
  2. components that have lead-containing or lead-free second level interconnect terminal finishes and materials;
  3. the maximum component temperature not to be exceeded during assembly or rework processing;
  4. the base materials used in the PCB construction, including those PCBs that use halogen-free resin;
  5. the surface finish of PCBs; and
  6. the conformal coating on PCBAs.
 

Document History

  1. IPC J-STD-609B

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    Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes

    • Most Recent
  2. IPC J-STD-609A


    Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes

    • Historical Version
  3. IPC J-STD-609


    Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes

    • Historical Version