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About This Item

 

Full Description

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
 

Document History

  1. IPC J-STD-033D

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    Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

    • Most Recent
  2. IPC J-STD-033C-1


    Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

    • Historical Version
  3. IPC J-STD-033C


    Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)

    • Historical Version
  4. IPC J-STD-033B


    Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)

    • Historical Version
  5. IPC J-STD-033


    Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

    • Historical Version