17262

IPC HM-860

Specification for Multilayer Hybrid Circuits

standard by Association Connecting Electronics Industries, 01/10/1987

View all product details

Most Recent

Track It

Language:
    • Available Formats
    •  
    • Availability
    • Priced From ( in USD )
    • Secure PDF
      ℹ

      Secure PDF Files

      Secure PDF files include digital rights management (DRM) software. DRM is included at the request of the publisher, as it helps them protect their copyright by restricting file sharing. In order to read a Secure PDF, you will need to install the FileOpen Plug-In on your computer. The FileOpen Plug-In works with Adobe Reader and other viewers. Visit FileOpen to see the full list.

        What you can do with a Secure PDF:
      • Print
      • Search
      • Highlight
      • Bookmark
      Please note that some publishers - including BOMA, IADC and ICML - do not allow printing of their documents.

    • Immediate download
    • $168.00
    • Add to Cart
    • Printed Edition
    • Ships in 1-2 business days
    • $168.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements.
 

Product Details

Published:
01/10/1987
Number of Pages:
66
File Size:
1 file , 550 KB
Product Code(s):
HM-860(D)1