17262

IPC HM-860

Specification for Multilayer Hybrid Circuits

standard by Association Connecting Electronics Industries, 01/10/1987

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Full Description

Covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate may include passive elements.
 

Product Details

Published:
01/10/1987
Number of Pages:
66
File Size:
1 file , 550 KB
Product Code(s):
HM-860(D)1
Note:
This product is unavailable in Belarus, Russia, Ukraine