IPC D-279
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996
Most Recent
Language:
-
- Available Formats
- Availability
- Priced From ( in USD )
-
-
Secure PDF
Secure PDF Files
Secure PDF files include digital rights management (DRM) software. DRM is included at the request of the publisher, as it helps them protect their copyright by restricting file sharing. In order to read a Secure PDF, you will need to install the FileOpen Plug-In on your computer. The FileOpen Plug-In works with Adobe Reader and other viewers. Visit FileOpen to see the full list.
-
What you can do with a Secure PDF:
- Print
- Search
- Highlight
- Bookmark
- Immediate download
- $168.00
- Add to Cart
-
Secure PDF
-
- Printed Edition
- Ships in 1-2 business days
- $168.00
- Add to Cart
Customers Who Bought This Also Bought
-
IPC SM-840E
Priced From $93.00 -
IPC HDBK-001H
Priced From $200.00 -
IPC M-106
Priced From $578.00 -
IPC J-STD-001H
Priced From $200.00
About This Item
Full Description
Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, costings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns.
