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IPC 9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

standard by Association Connecting Electronics Industries , 02/01/2022

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Full Description

This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

 

Product Details

Published:
02/01/2022
ISBN(s):
9781638160724
Number of Pages:
24
File Size:
1 file , 1 MB
Product Code(s):
9701-STD-0-D-0-EN-B, 9701-STD-0-D-0-EN-B
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This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC 9701B

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    Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

    • Most Recent

  2. IPC 9701A


    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version

  3. IPC 9701


    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version