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About This Item

 

Full Description

This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

 

Document History

  1. IPC 9701B

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    Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

    • Most Recent
  2. IPC 9701A


    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version
  3. IPC 9701


    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version