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About This Item

 

Full Description

Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM-785, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments. Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints.
 

Document History

  1. IPC 9701B


    Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

    • Most Recent
  2. IPC 9701A

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    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version
  3. IPC 9701


    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version