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About This Item

 

Full Description

Provides specific test methods used in the establishment of levels of performance and reliability for surface mount solder attachments of electronic assemblies. In addition to an understanding of the physics of surface mount solder joint failure, this document also provides an approximate means of relating the results from the performance test methods included to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
 

Document History

  1. IPC 9701B


    Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

    • Most Recent
  2. IPC 9701A


    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version
  3. IPC 9701

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    Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

    • Historical Version