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About This Item
Full Description
This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.
Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SOFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.
Document History
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IPC 7351B
currently
viewing
Generic Requirements for Surface Mount Design and Land Pattern Standard- Most Recent
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IPC 7351A
Generic Requirements for Surface Mount Land Pattern and Design Standard - INCLUDES LAND PATTERN VIEWER SOFTWARE- Historical Version
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IPC 7351
Generic Requirements for Surface Mount Land Pattern and Design Standard - INCLUDES LAND PATTERN VIEWER SOFTWARE- Historical Version