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About This Item

 

Full Description

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection and repair, IPC-7095A also addresses reliability issues and the use of lead free joint criteria associated with BGAs. There are many new photographs of X-ray or endoscope illustrations to identify some of the chracteristics that the industry is experiencing in the implementation of BGA assembly processes. The effect of BGA and FBGA on current technology and component types is also discussed.
 

Document History

  1. IPC 7095D-WAM1


    Design and Assembly Process Implementation for BGAs, Includes Amendment 1

    • Most Recent
  2. IPC 7095D


    Design and Assembly Process Implementation for BGAs

    • Historical Version
  3. IPC 7095C


    Design and Assembly Process Implementation for BGAs

    • Historical Version
  4. IPC 7095B


    Design and Assembly Process Implementation for BGAs

    • Historical Version
  5. IPC 7095A

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    Design and Assembly Process Implementation for BGAs

    • Historical Version