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About This Item

 

Full Description

This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, PTFE smear and dielectric removal. For use with IPC-6011. Supersedes IPC-6018B and IPC-6016.
 

Document History

  1. IPC 6018D


    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    • Most Recent
  2. IPC 6018C

    👀currently
    viewing


    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

    • Historical Version
  3. IPC 6018B


    Microwave End Product Board Inspection and Test

    • Historical Version
  4. IPC 6018A


    Microwave End Product Board Inspection and Test

    • Historical Version
  5. IPC 6016


    Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IPC 6018CS


    Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards