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About This Item

 

Full Description

IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.
 

Document History

  1. IPC 6012E

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    viewing


    Qualification and Performance Specification for Rigid Printed Boards

    • Most Recent
  2. IPC 6012D-AM1


    Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

    • Historical Version
  3. IPC 6012D


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version
  4. IPC 6012C


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version
  5. IPC 6012B


    Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

    • Historical Version
  6. IPC 6012A-AM


    Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1

    • Historical Version
  7. IPC 6016


    Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

    • Historical Version