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About This Item

 

Full Description

The IPC-6012D-AM1 makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6012D. The IPC-6012D-AM1 implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after January 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements proven on newer designs. The IPC-6012D-AM1 is not applicable to legacy product that will remain subject to IPC-6012D copper wrap plating requirements.
 

Document History

  1. IPC 6012D-AM1

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    viewing


    Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

    • Most Recent
  2. IPC 6012D


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version
  3. IPC 6012C


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version
  4. IPC 6012B


    Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

    • Historical Version
  5. IPC 6012A-AM


    Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1

    • Historical Version
  6. IPC 6016


    Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

    • Historical Version