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About This Item

 

Full Description

This specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as selection for procurement, new surface finishes, hole plating thickness, measling, weave exposure, copper cap plating of filled holes, laminate cracks and voids, etchback, blind and buried via fill, acceptance testing and frequency, and requirements for thermal stres testing. This revision synchronizes to the IPC-A-600H.
 

Document History

  1. IPC 6012E


    Qualification and Performance Specification for Rigid Printed Boards

    • Most Recent
  2. IPC 6012D-WAM1


    Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

    • Historical Version
  3. IPC 6012D


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version
  4. IPC 6012C

    👀currently
    viewing


    Qualification and Performance Specification for Rigid Printed Boards

    • Historical Version
  5. IPC 6012B


    Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1

    • Historical Version
  6. IPC 6012A-AM


    Qualification and Performance Specification for Rigid Printed Boards - Includes Amendment 1

    • Historical Version
  7. IPC 6016


    Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

    • Historical Version