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About This Item

 

Full Description

IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.

 

Document History

  1. IPC 4552B

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    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

    • Most Recent
  2. IPC 4552A


    Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

    • Historical Version
  3. IPC 4552-WAM1-2


    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2

    • Historical Version
  4. IPC 4552


    Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2

    • Historical Version