IPC 4552B
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 07/27/2021
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About This Item
Full Description
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
Document History
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IPC 4552B
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Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards- Most Recent
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IPC 4552A
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards- Historical Version
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IPC 4552-WAM1-2
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2- Historical Version
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IPC 4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2- Historical Version
