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IPC 4101E-WAM1

Specification for Base Materials for Rigid and Multilayer Printed Boards

standard by Association Connecting Electronics Industries, 04/01/2020

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About This Item

 

Full Description

IPC-4101E-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets which are found after the main body of the standard. The specification sheets are to be used primarily for rigid and multilayer printed boards for electronic interconnections. The IPC-4101E-WAM1 standard contains 70 individual specification sheets that can be searched using keywords. The keywords allow users to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. The IPC-4101E-WAM1 includes an Appendix A that provides supplemental inspection requirements, but only if required in the material user's purchase order or master drawing.
 

Product Details

Published:
04/01/2020
ISBN(s):
9781951577186
Number of Pages:
176
File Size:
1 file , 790 KB
Product Code(s):
4101-STD-0-D-W1-EN-E, 4101-STD-0-P-W1-EN-E
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC 4101E-WAM1

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    viewing


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Most Recent

  2. IPC 4101E


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version

  3. IPC 4101D-WAM1


    Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1

    • Historical Version

  4. IPC 4101D


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version

  5. IPC 4101C


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version

  6. IPC 4101B


    Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)

    • Historical Version

  7. IPC 4101A


    Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)

    • Historical Version

  8. IPC 4101


    Specifications for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version

  9. IPC L-108B


    Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

    • Historical Version