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About This Item

 

Full Description

This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document's user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. This revision's 11 new specification sheets reflect the expanded offerings for current commercially available laminates and prepregs. These 11 new specification sheets add laminate and prepreg materials to this document that have improved or additional properties that include one or more of the following: low halogen content, lead-free applications, high thermal performance or high speed/high frequency performance.
 

Document History

  1. IPC 4101E-WAM1


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Most Recent
  2. IPC 4101E


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  3. IPC 4101D-WAM1


    Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1

    • Historical Version
  4. IPC 4101D


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  5. IPC 4101C

    👀currently
    viewing


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  6. IPC 4101B


    Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)

    • Historical Version
  7. IPC 4101A


    Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)

    • Historical Version
  8. IPC 4101


    Specifications for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  9. IPC L-108B


    Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

    • Historical Version