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About This Item

 

Full Description

This specification covers the requirements for base materials (laminate and prepreg) to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. This document contains more than 50 separate specification sheets and now uses search terms to allow the user to find similar groups of materials from these specification sheets. This standard provides the user with additional information and data on printed circuit board materials that are better able to withstand the newer assembly operations employing higher thermal exposures, including those assembly practices that utilize the now commonly-encountered lead free solders.
 

Document History

  1. IPC 4101E-WAM1


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Most Recent
  2. IPC 4101E


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  3. IPC 4101D-WAM1


    Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1

    • Historical Version
  4. IPC 4101D


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  5. IPC 4101C


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  6. IPC 4101B

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    viewing


    Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)

    • Historical Version
  7. IPC 4101A


    Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)

    • Historical Version
  8. IPC 4101


    Specifications for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  9. IPC L-108B


    Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

    • Historical Version