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About This Item

 

Full Description

Replaces IPC-L-108, IPC-L-109B, IPC-L-112A, IPC-L-115B. Covers the requirements for base materials (laminate or prepreg) to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. IPC-4101 includes specification sheets for laminate and prepeg separated by family with a cross-reference to their NEMA and former military designations.
 

Document History

  1. IPC 4101E-WAM1


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Most Recent
  2. IPC 4101E


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  3. IPC 4101D-WAM1


    Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1

    • Historical Version
  4. IPC 4101D


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  5. IPC 4101C


    Specification for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  6. IPC 4101B


    Specifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)

    • Historical Version
  7. IPC 4101A


    Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)

    • Historical Version
  8. IPC 4101

    👀currently
    viewing


    Specifications for Base Materials for Rigid and Multilayer Printed Boards

    • Historical Version
  9. IPC L-108B


    Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

    • Historical Version