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IPC 2222

Sectional Standard on Rigid PWB Design

standard by Association Connecting Electronics Industries , 03/01/1998

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Full Description

Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single, double or multi-layered boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters. This document should be used in conjunction with IPC- 2221.
 

Product Details

Published:
03/01/1998
Number of Pages:
24
File Size:
1 file , 900 KB
Product Code(s):
2222(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC 2222B


    Sectional Design Standard for Rigid Organic Printed Boards

    • Most Recent

  2. IPC 2222A


    Sectional Design Standard for Rigid Organic Printed Boards

    • Historical Version

  3. IPC 2222

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    Sectional Standard on Rigid PWB Design

    • Historical Version