This article summarizes the installation demonstration of R25 composite insulation boards containing polyisocyanurate (PIR) foam-encapsulated modified atmosphere insulation (MAI) panels. The R25 boards can achieve a thermal resistance of 25 hr-ft2-°F/Btu (4.4 m2-K/W) within 2 inches (5.1 cm) of thickness. MAI represents a lower-cost version of vacuum insulation panels (VIPs). The R25 composite boards were developed by the project team consisting of a foam insulation manufacturer, a vacuum insulation manufacturer and a research organization. R25 boards were used to retrofit a section of a low-slope roof. For comparison, adjacent roof sections were retrofitted with two layers of 2 inch (5.1 cm) regular PIR foam boards.

The retrofit installation was performed by professional roofing contractors and some weight-related issues were identified. In a follow-on discussion within the project team, mitigation methods were proposed. The long-term thermal performance of the R25 and regular PIR foam boards are being monitored using temperature and heat flow sensors installed above and below the insulation layers. Preliminary data analysis results are presented here.