This generic standard may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. This standard establishes the metric modular order for parallel mounted, interconnected electronic circuit assemblies, hereafter referred to as mezzanine cards, and may be applied in other applications. The choice of coordination dimensions for the mechanical structure lies within a homogeneous, metric, modular, three-dimensional grid as specified in IEC 917.2-1992 and referenced in IEEE Std 1301-1991.1 Optimum conditions are thereby created for the application of computer-assisted methods throughout design and manufacturing, e.g., computer-assisted planning, development, manufacturing, testing, and installation. Due to the application-specific nature of mezzanine cards, the electrical and mechanical interconnect implementation will require definition that is beyond the scope of this document.