 Preview

IEC 62878-1 Ed. 1.0 b:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

standard by International Electrotechnical Commission , 10/14/2019

This document has been replaced. View the most recent version.

View all product details

Historical

Track It

- Available Formats
  ℹ
- Options
- Availability
- Priced From ( in USD )
- PDF
- 👥
- Immediate download
- $145.00
- Add to Cart
- Printed Edition
- Ships in 1-2 business days
- $145.00
- Add to Cart

Customers Who Bought This Also Bought

IEC 61191-1 Ed. 3.0 b:2018
Priced From $329.00
IEC 61249-5-1 Ed. 1.0 b:1995
Priced From $145.00
IEC 62326-1 Ed. 2.0 b:2002
Priced From $367.00
IEC 61189-6 Ed. 1.0 b:2006
Priced From $329.00

Full Description

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.

Product Details

Edition:: 1.0
Published:: 10/14/2019
Number of Pages:: 38
File Size:: 1 file , 1.6 MB
Note:: This product is unavailable in Ukraine, Russia, Belarus, Canada