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About This Item

 

Full Description

Describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) This standard was updated and editorially revised. Specific reference is made to: IEC/TS 61340-5-1: Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements IEC/TS 61340-5-2: Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide For convenience of the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from IEC 60721-3-1 and IEC 60721-3-2).
 

Document History

  1. IEC 61760-2 Ed. 2.0 b:2007


    Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

    • Most Recent
  2. IEC 61760-2 Ed. 2.0 en:2007

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    Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

    • Historical Version
  3. IEC 61760-2 Ed. 1.0 b:1998


    Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

    • Historical Version