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IEC 61189-2 Ed. 2.0 en:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

standard by International Electrotechnical Commission , 05/30/2006

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Full Description

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
 

Product Details

Edition:
2.0
Published:
05/30/2006
Number of Pages:
122
File Size:
1 file , 1.2 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 61189-2 Ed. 2.0 en:2006

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    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

    • Most Recent

  2. IEC 61189-2 Ed. 1.0 b:1997


    Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

    • Historical Version