Data centers and telecommunications rooms that house datacom equipment are becoming increasingly more difficult to adequately cool. This is a result of IT manufacturers increasing datacom performance year after year at the cost of increased heat dissipation. Even though performance has, in general, increased at a more rapid rate than power, the power required and the resulting heat dissipated by the datacom equipment has increased to a level that is putting a strain on data centers.

In the struggle to improve the thermal management characteristics of data centers, it is sometimes important to assess today's data center designs. The objective of this book is to provide a series of case studies of high density data centers and a range of ventilation schemes that demonstrate how loads can be cooled using a number of different approaches.

This book is the seventh in a series of datacom books authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technology Spaces and Electronic Equipment. 

The physical copy version is 6 x 9 in. in size and softcover. The book was printed on 30% post-consumer waste using soy-based inks.