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ESD SP5.3.3-2018 establishes the procedure for testing devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined contact CDM electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, optoelectronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices can be characterized according to this standard practice.